June 19, 2003

Boise State University to Host International Microelectronics Symposium June 30-July2

In 1953 a new technology called the transistor made possible a groundbreaking medical device — the hearing aid. Now 50 years later, electronic devices that were unimaginable in the 1950s pervade not only the world of medicine but also our everyday life — in cell phones, PDAs, cameras, cars and much more.     As electronic devices scale down from the micro scale (measured in one millionth of a meter) to nano scale (measured in one billionth of a meter), what amazing advances and applications will this next wave of devices bring? On-chip DNA analysis, microscalpels for precision eye surgery, on-chip “electronic noses” for detecting dangerous gases or explosives, microspacecraft for deep space missions. These are just a few of the 100 presentations on micro/nanotechnologies, clean room fabrication techniques, integrated circuit designs, and microelectronics research and education programs that will be showcased at the IEEE University/Government/Industry Microelectronics Symposium (UGIM ’03) to be held at Boise State University June 30-July 2.     This international symposium, sponsored by the Institute of Electrical and Electronics Engineers’ Electron Devices Society, has been held in various major U.S. cities for the past 30 years, and will be the first international engineering conference ever hosted in Boise. Boise State’s growing international recognition for expertise in the field of micro/nanotechnology research and education, as well as Micron Technology’s prominence in the semiconductor industry resulted in the opportunity for Boise to host this event, which will be held in the Jordan Ballroom of Boise State’s Student Union.     About 300 researchers from 40 universities and 20 corporate/government labs around the world will be attending. Researchers from Boise State, University of Idaho, Idaho State University, and several local companies are also among the presenters. Regional engineers, educators, and scientists are invited to attend. For program information and on-line pre-registration, go to: http://coen.boisestate.edu/ugim03.     A hallmark of past UGIM symposia has been to highlight and encourage public-private partnerships, and research collaborations between universities, government agencies, and industry labs. This is reflected in the opening keynote session of the symposium at 8:30 am on June 30, where renowned UC Berkeley researcher Dr. Tsu-Jae King will present “Sustaining the Silicon Revolution.” Her presentation will be followed by Micron CEO Steve Appleton’s “Mutual Dependence, Mutual Success: Collaboration Benefits All,” and Sen. Larry Craig’s “It’s the Little Things That Matter.” In addition, the symposium will recognize Dr. Lynn Fuller from Rochester Institute of Technology as the first recipient of the Microelectronics Leadership Award for his years of work in promoting education/industry partnerships.     Presentations will range from semiconductor design/manufacturing breakthroughs, to medical applications, to education/research models. A few samples are:     * Micro-sensors that quickly detect harmful viruses or bacteria by detecting their DNA, presented by researchers from the Rochester Institute of Technology.     * Design of micro-power, low-noise circuitry for deep space missions by researchers at the University of North Carolina-Charlotte, University of Tennessee-Knoxville and the Jet Propulsion Laboratory.     * Sensors to detect environmental pollutants, by professors at Boise State.     * A novel approach to encourage high school students to see the connections between math and science curriculum and technology careers, by a professor from the University of South Florida.     Events of special interest to participants include:     * A pre-conference open house at Boise State’s Idaho Microfabrication Laboratory at 4 p.m. June 29.     *A Basque cultural program and banquet for attendees at 6 p.m. July 1 on the Basque Block in Boise.     The technical co-sponsors of the symposium are the Micron Foundation, the Boise chapter of the IEEE Electron Devices Society and the College of Engineering at Boise State. Contact Steve Parke Electrical Engineering 208 426-3842 cell 208 249-1241 sparke@boisestate.edu Media contacts Pat Pyke communications and marketing 208 426-1987 ppyke@boisestate.edu

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